Advanced materials for thermal management of electronic packaging

Author：by Xingcun Colin Tong.
Publisher：Springer Springer Science+Business Media, LLC
ISBN：9781441977595 (electronic bk.) ; 9781441977588 (paper)
Publication Date：2011
其他作者：Tong, Xingcun Colin.
語言：zh
出版地：New York, NY :
Description
xxi, 606 p. ::ill. (some col.), digital ;:24 cm.
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